Product Details

MGP模具

主要用于集成电路和半导体器件的后工序封装。适用100引线以内的各式IC产品;TO、SMA、SMB、SMC、SOD等功率器件;钽电容;桥堆类等产品。

Technical Features

多料筒,多注射头的封装形式:模盒采用快换式结构,维护方便。

  • 流道系统实现近距离填充,封装质量提升

  • 模盒采用快换结构,使用维护方便

  • 树脂利用率相比传统模具大幅提升

  • 可满足矩阵式多排L/F封装

OTHER PRODUCT

Next ool has rapidly developed into one of the leading extrusion tool system suppliers in China and enjoys an international reputation in the field of plastic extrusion.