COMPANY PROFILE

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NEXTOOL TECHNOLOGY CO.,LTD.

Founded in October, 2005, national high-tech enterprise Nextool Technology Co., Ltd. (Named Nextool thereafter) is mainly work on applying plastic extrusion forming and semiconductor packaging field ‘s intelligent manufacturing equipment’s development, manufacturing and sales, to provide customized intelligent manufacturing equipment and systematic solution for customers, main products are plastic extrusion tooling and downstream equipment, semiconductor packaging equipment and molds.

The company has a 6.15 million registered capital,Nextool had more than 50 patents relying on complete development system and persist innovation ability. Nextool imported world top class level manufacturing equipment from Swiss land, Japan and Germany like EDM and four coordinates wire cutting machine, graphite electrode high-speed milling machine, optical curve grinding machine and etc., inspection equipment including three coordinate imagers from Germany Zeiss and three coordinates inspection machines to ensure micron-sized manufacturing.

The company systematically mastered plastic extrusion forming core technology, constantly design and develop plastic extrusion forming tooling and equipment that satisfied customer by intensive study on plastic extrusion forming theory, plastic melt rheology, mechanic and electrical integration technology. Nextool’s products covers more than 40 countries world widely, provides service to Aluplast Group, Profine Group and REHAU Group from Germany, Deceunick Group from Belgium, Austroplast, Eastern Wholesales Fence, PlyGem Group from U.S.A. and other famous international brands by its advanced designing concept, unique process technology, reliable product quality, experienced tuning service and complete after-sales service.

The company successfully developed semiconductor fully automated packaging system, fully automated tubing cutting system and cutting mold, and related equipment based on mastered plastic forming theory, precision machine designing and manufacturing, electric automatization control, complete R&D system and constant innovation ability that mainly applied on precision packaging of integrated circuit and discrete device. The company provided semiconductor packaging equipment and mold to globe top 10 semiconductor packaging enterprise such as TFME (002156), Tianshui Huatian Technology Co., Ltd, (002185), JCET Group Co., Ltd, (600584), PANJIT Group, Jingdao Microelectronics and many other famous companies in China that is one of the few domestic suppliers provides semiconductor packaging equipment and mold.

The company is national high-tech enterprise, Anhui technology innovation demonstration enterprise, Anhui specialized new small and medium sized enterprise. The company has provincial certified enterprise technical center and established post-doctor develop and research workstation. Nextool is awarded “national high technology enterprise”, “manufacturing championship of single event” (2019-2021) by Ministry of Industry and Information Technology of the Peoples Republic of China (MIIT) on November, 2018. On November, 2021, company had past the third batch “manufacturing championship of single event” re-check. Undertook the major science and technology special project of Anhui Province in 2018 ”Integrated Circuit Automatic Packaging System NTASM200” project, in 2019, the company was awarded the honorary title of ”2017-2020 Mold Export Key Enterprise” by China Die & Mould Industry Association. In 2020, the company was awarded the second prize of Science and Technology of Anhui Province -- Key Technology and Industrialization of Intelligent Extrusion Tooling Equipment by Anhui Provincial Peoples Government and the honorary title of ”China key Backbone Mould Enterprise plastic Profile Extrusion Mould” by China Die & Mould Industry Association. The companys product ”automatic packaging system AMS120-PS” won the honor of ”the first set of major technical equipment in Anhui Province in 2020”.In 2021, the company won the honorary title of ”2020-2021 China Semiconductor Packaging and Testing Equipment Enterprise with the Most Development Potential” awarded by the Organizing committee of China International Semiconductor Packaging and Testing Conference, and was elected as the Council unit of the National INTEGRATED circuit Packaging and testing Industry Chain Technology Innovation Strategic Alliance.

The company is adhering the mission of “creating more value for you” and the managing concept of “persistence, innovation, cooperation, harmony” to persist in applying leading technology, perfect quality and quick service to satisfy customers and to accelerate sound and sustainable development of intelligence manufacturing equipment industry in China.